• Space-based experiments show wax-filled heat sinks keep electronics cooler for longer
    Thursday, July 3, 2025 from Phys.org: Semiconductors News
    An interdisciplinary research team including mechanical science and engineering professor Mickey Clemon from the Grainger College of Engineering at the University of Illinois Urbana-Champaign is investigating cooling methods for heat...
  • Aixtron leading project to increase energy efficiency in SiC layer deposition
    Thursday, July 3, 2025 from Semiconductor Today News
    In cooperation with Erlangen-based Fraunhofer IISB (Institute for Integrated Systems and Device Technology) and Neuss-based bimanu Cloud Solutions GmbH in Germany, Herzogenrath-based deposition equipment maker Aixtron SE is leading a...
  • Quantum machine learning improves semiconductor manufacturing for first time
    Thursday, July 3, 2025 from Phys.org: Semiconductors News
    Semiconductor processing is notoriously challenging. It is one of the most intricate feats of modern engineering due to the extreme precision required and the hundreds of steps involved, such as etching and layering, to make even a...
  • TSMC to cease GaN foundry production by end-July 2027 due to price pressure from Chinese rivals
    Thursday, July 3, 2025 from Semiconductor Today News
    When gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA announced a strategic partnership for Taiwanese foundry Powerchip Semiconductor Manufacturing Corp (PSMC) to...
  • Mouser enters distribution agreement with Ampleon
    Thursday, July 3, 2025 from Semiconductor Today News
    Mouser Electronics Inc (a Berkshire Hathaway company) has announced a global distribution agreement with Ampleon B.V. of Nijmegen, The Netherlands, which manufactures radio frequency power devices based on gallium nitride (GaN) and LDMOS...
  • Go Maruyama becomes pSemi’s CEO as Tatsuo Bizen retires
    Thursday, July 3, 2025 from Semiconductor Today News
    Murata company pSemi Corp of San Diego, CA, USA – a fabless provider of radio-frequency (RF), analog and mixed-signal solutions – has announced leadership changes and organizational restructuring to support its evolving business strategy...
  • Infineon on track to ship customer samples of GaN on 300mm wafers in Q4/2025
    Wednesday, July 2, 2025 from Semiconductor Today News
    Infineon Technologies AG of Munich, Germany says that its scalable gallium nitride (GaN) manufacturing on 300mm wafers is on track for first samples to be available to customers as of fourth-quarter 2025, positioning it to expand its...
  • Stretchable polymer foam sensor detects wide range of motion with high sensitivity
    Wednesday, July 2, 2025 from Phys.org: Semiconductors News
    A research team led by Prof. Wang Long from the Ningbo Institute of Materials Technology and Engineering (NIMTE) of the Chinese Academy of Sciences has developed a highly stretchable and conductive foam sensor with an ultra-wide...
  • Innovative ternary alloy films pave the way for ultra-low-power memory devices
    Wednesday, July 2, 2025 from Phys.org: Semiconductors News
    A recent study reports (Al,Ga,Sc)N thin films with record-high scandium levels, with exciting potential for ultra-low-power memory devices, as reported by researchers from Institute of Science Tokyo (Science Tokyo). Using reactive...
  • Switch is building 'AI factories' in Las Vegas
    Wednesday, July 2, 2025 from Phys.org: Semiconductors News
    Las Vegas data-center owner Switch is expanding its big presence in Southern Nevada with a new kind of facility: so-called AI factories.
  • Wolfspeed files for bankruptcy in effort to turn around NC chipmaker
    Wednesday, July 2, 2025 from Phys.org: Semiconductors News
    The 38-year-old Durham, North Carolina, semiconductor supplier Wolfspeed filed for Chapter 11 bankruptcy, officially starting a reorganization the company says will allow it to shed billions in debt.
  • Navitas plans 200mm GaN production with PSMC
    Wednesday, July 2, 2025 from Semiconductor Today News
    Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced a strategic partnership with Taiwanese foundry Powerchip Semiconductor Manufacturing Corp (PSMC) to...
  • Wavetek deploys Silvaco’s Victory TCAD for GaN-based device development
    Tuesday, July 1, 2025 from Semiconductor Today News
    Silvaco Group Inc of Santa Clara, CA, USA — which provides technology computer-aided design (TCAD), electronic design automation (EDA) software and semiconductor intellectual property (SIP) for process and device development — says that...
  • NUBURU reports progress in acquisition of Tekne as part of Defense & Security Hub
    Tuesday, July 1, 2025 from Semiconductor Today News
    NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — has reported progress in its strategic transformation, including developments within its planned Defense &...
  • Wolfspeed files for Chapter 11 bankruptcy as part of financial restructuring
    Tuesday, July 1, 2025 from Semiconductor Today News
    Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has taken the next step to implement its previously announced restructuring support agreement (RSA) with key lenders,...
  • Shape memory polymers with nanotips help solve micro-LED chip transfer problem
    Monday, June 30, 2025 from Phys.org: Semiconductors News
    A research team at Pohang University of Science and Technology (POSTECH), has developed a novel dry adhesive technology that allows everything from microscale electronic components to common household materials to be easily attached and...
  • Pragmatic appoints John Quigley as executive VP of Engineering
    Monday, June 30, 2025 from Semiconductor Today News
    Flexible integrated circuit (FlexIC) designer and manufacturer Pragmatic Semiconductor Ltd of Cambridge, UK has appointed John Quigley as executive VP (EVP) of engineering with responsibility for technology development, IC design and...
  • CSconnected names first recipients for £1m Supply Chain Development Programme
    Monday, June 30, 2025 from Semiconductor Today News
    The South Wales-based compound semiconductor cluster CSconnected, in partnership with Cardiff Capital Region (CCR), has announced the first four successful applicants to its £1m Supply Chain Development Programme, aimed at strengthening...
  • Flexible e-textile uses 3D-printed sensors to monitor and optimize combat training routines
    Monday, June 30, 2025 from Phys.org: Semiconductors News
    Traditional military training often relies on standardized methods, which has limited the provision of optimized training tailored to individual combatants' characteristics or specific combat situations. To address this, a research team...
  • US-based GlobalFoundries investing extra $3bn for R&D on silicon photonics, advanced packaging and GaN
    Monday, June 30, 2025 from Semiconductor Today News
    GlobalFoundries of Malta, NY, (GF, the only US-based pure-play foundry with a global manufacturing footprint including facilities in the USA, Europe and Singapore) plans to invest another $3bn in its expansion of semiconductor...
  • III-V Epi brings independent, epi manufacturing expertise to Glasgow’s Critical Technologies Accelerator program
    Monday, June 30, 2025 from Semiconductor Today News
    III–V Epi Ltd of Glasgow, Scotland, UK — which provides a molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD) service for custom compound semiconductor wafer design, manufacturing, test and characterization —...
  • UIUC reveals ‘efficiency cliff’ when LEDs are scaled to submicron dimensions
    Monday, June 30, 2025 from Semiconductor Today News
    Researchers at the University of Illinois Urbana-Champaign (UIUC) in the USA have fabricated blue light-emitting diodes (LEDs) down to an unprecedented 250nm in size, a critical step for next-generation technologies like...
  • High-performance memory devices can dissolve in water to address e-waste problem
    Friday, June 27, 2025 from Phys.org: Semiconductors News
    The use of electronics in various forms is on the rise, from wearable devices like smartwatches to implantable devices like body-implanted sensors, skin-worn smart patches, and disposable monitoring devices. These devices, which are...
  • SuperLight unveils light source for high-performance spectroscopy
    Friday, June 27, 2025 from Semiconductor Today News
    SuperLight Photonics of Enschede, the Netherlands — a spin-off from the University of Twente that is developing a photonic integrated circuit (PIC) wideband laser light source for measurement and detection applications — has unveiled the...
  • Wise Integration launches first digital controller for GaN totem-pole PFC
    Thursday, June 26, 2025 from Semiconductor Today News
    Fabless company Wise-integration of Hyeres, France — which was spun off from CEA-Leti in 2020 and designs and develops digital control for gallium nitride (GaN) and GaN IC-based power supplies — has released to production its first fully...
  • Researchers outline innovative ways to track heat in advanced semiconductors
    Thursday, June 26, 2025 from Phys.org: Semiconductors News
    When electronic devices overheat, they can slow down, malfunction, or stop working altogether. This heat is mainly caused by energy lost as electrons move through a material—similar to friction in a moving machine.
  • EFFECT Photonics raises extra $24m in Series D funding round
    Thursday, June 26, 2025 from Semiconductor Today News
    EFFECT Photonics b.v. – a spin off from the Technical University of Eindhoven (TU/e) in The Netherlands that provides next-generation coherent optical solutions for data-center and edge networks – has raised an additional $24m as part of...
  • Innoscience and Midea partner to accelerate GaN adoption in home appliance industry
    Thursday, June 26, 2025 from Semiconductor Today News
    InnoScience (Suzhou) Technology Holding Co Ltd — which manufactures gallium nitride on silicon (GaN) power chips on 8” silicon wafers — and Midea (the largest producer of home appliances and industrial robots) have reached a strategic...
  • BluGlass closes share purchase plan, raising a further $5.3m
    Thursday, June 26, 2025 from Semiconductor Today News
    BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has...
  • ELENA project develops Europe’s first LNOI substrates for photonic integrated circuits, completing supply chain
    Wednesday, June 25, 2025 from Semiconductor Today News
    Funded by the European Commission under the Horizon 2020 program as a collaborative research and innovation initiative (grant agreement n°101016138), the recently concluded 42-month project ELENA (‘European electro-optic and nonlinear...
  • Self-healing electronic material uses graphene and polymer blend to mimic skin
    Wednesday, June 25, 2025 from Phys.org: Semiconductors News
    Researchers at DTU have developed a new kind of electronic material that behaves almost exactly like human skin. The substance could be useful in soft robotics, medicine, and health care.
  • EPC Space launches 300V rad-hard GaN FET
    Wednesday, June 25, 2025 from Semiconductor Today News
    EPC Space LLC of Haverhill, MA, USA (which provides high-reliability radiation-hardened enhancement-mode gallium nitride-on-silicon transistors and ICs for power management in space and other harsh environments) has launched the...
  • Silvaco and Fraunhofer ISIT collaborate on developing GaN device technology
    Wednesday, June 25, 2025 from Semiconductor Today News
    Silvaco Group Inc of Santa Clara, CA, USA — which provides technology computer-aided design (TCAD), electronic design automation (EDA) software and semiconductor intellectual property (SIP) for process and device development — has...
  • MIT-led team develops low-cost, scalable process for integrating GaN transistors onto silicon CMOS chips
    Tuesday, June 24, 2025 from Semiconductor Today News
    Gallium nitride (GaN) will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers, but its high cost and the specialization required to incorporate it...
  • PhotonDelta and Luminate NY collaborate on transatlantic growth network for photonics startups
    Tuesday, June 24, 2025 from Semiconductor Today News
    Photonic chips industry accelerator PhotonDelta of Eindhoven, the Netherlands (which connects and collaborates with an ecosystem of photonic chip technology organizations worldwide) and Luminate NY of Rochester, NY, USA (the world’s...
  • CSA Catapult to mobilize new UK Semiconductor Centre
    Tuesday, June 24, 2025 from Semiconductor Today News
    The UK Government says that Compound Semiconductor Applications (CSA) Catapult will mobilize the new UK Semiconductor Centre (UKSC)...
  • Compute-in-memory chip shows promise for enhanced efficiency and privacy in federated learning systems
    Tuesday, June 24, 2025 from Phys.org: Semiconductors News
    In recent decades, computer scientists have been developing increasingly advanced machine learning techniques that can learn to predict specific patterns or effectively complete tasks by analyzing large amounts of data. Yet some studies...
  • TNO to construct InP-based photonic chip pilot manufacturing line
    Tuesday, June 24, 2025 from Semiconductor Today News
    At the end of this year, research institute TNO (the Netherlands Organization for Applied Scientific Research in Delft) will begin constructing a pilot manufacturing line for photonic chips at the High Tech Campus in Eindhoven. The new...
  • EPC releases compact, high-efficiency 180W GaN buck converter evaluation board for USB PD applications
    Tuesday, June 24, 2025 from Semiconductor Today News
    Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has released...
  • UMass Lowell assistant professor Anhar Bhuiyan receives Ralph E. Powe Junior Faculty Enhancement Award
    Monday, June 23, 2025 from Semiconductor Today News
    The University of Massachusetts Lowell says that Electrical Engineering assistant professor Anhar Bhuiyan is among 36 recipients of this year’s Ralph E. Powe Junior Faculty Enhancement Awards, nationally competitive seed grants for...
  • ROHM’s SiC MOSFET adopted for mass production in Toyota’s new BEV for Chinese market
    Monday, June 23, 2025 from Semiconductor Today News
    The power module equipped with Japan-based ROHM Co Ltd’s fourth-generation silicon carbide (SiC) MOSFET bare chip has been adopted in the traction inverter of Toyota Motor Corp’s new bZ5 crossover-type battery electric vehicle (BEV) for...
  • TU/e establishes new research institute for semiconductors, quantum photonics, and high-tech systems
    Monday, June 23, 2025 from Semiconductor Today News
    Technical University of Eindhoven (TU/e) in The Netherlands is establishing a new research institute dedicated to semiconductors, quantum, photonics, and the development of high-tech systems and chips of the future...
  • New laser power converters can transmit power to further, remote destinations
    Monday, June 23, 2025 from Phys.org: Semiconductors News
    From smart grids to the internet of things, the modern world is increasingly reliant on connectivity between electronic devices. Thanks to University of Ottawa researchers, these devices can now be simultaneously connected and powered...
  • 'Soft-touch' approach advances nondestructive testing for micro-LED wafers
    Monday, June 23, 2025 from Phys.org: Semiconductors News
    Tianjin University scientists have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel "soft-touch" approach.
  • Renesas expects $1.7bn loss in first-half 2025 from Wolfspeed restructuring
    Monday, June 23, 2025 from Semiconductor Today News
    Renesas Electronics Corp of Tokyo, Japan says that, as a resuts of entering into a restructuring support agreement with Wolfspeed Inc of Durham, NC, USA and its principal creditors for the financial restructuring of Wolfspeed, it hence...
  • Wolfspeed’s restructuring deal with lenders to reduce debt by 70% and interest payments by 60%
    Monday, June 23, 2025 from Semiconductor Today News
    As part of its efforts to strengthen its capital structure, Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has entered into a restructuring support agreement (RSA) with...
  • Diamond Technologies acquires Akhan’s asset portfolio, including patents in diamond films.
    Monday, June 23, 2025 from Semiconductor Today News
    Materials innovation company Diamond Technologies Inc (DTI) of Hudson, MA, USA (which is developing and commercializing diamond-based solutions for semiconductors, aerospace, defense, optics and industrial applications) has acquired the...
  • US Navy funds Aeluma to accelerate development and commercialization of high-speed photodetectors for optical interconnects
    Monday, June 23, 2025 from Semiconductor Today News
    Aeluma Inc of Goleta, CA, USA — which develops compound semiconductor materials on large-diameter substrates — has announced a contract with the US Navy that could accelerate development of high-speed photodetectors for government and...
  • OKI and NTT establish mass-production technology for high-power terahertz devices by heterogeneous material bonding
    Monday, June 23, 2025 from Semiconductor Today News
    Tokyo-based Oki Electric Industry Co Ltd, in collaboration with Japan-based NTT Innovative Devices Corp, has established mass-production technology for high-power terahertz devices using its proprietary crystal film bonding (CFB)...
  • Tagore launches compact, high-power RF receiver front-end module
    Monday, June 23, 2025 from Semiconductor Today News
    Chicago-based fabless firm Tagore Technology Inc — which was founded in 2011 and has design centers in Arlington Heights, IL, USA and Kolkata, India developing gallium nitride-on-silicon (GaN-on-Si) technology for RF and power management...
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